ACF is a known good way to create an array of conductive/isolating paths based on thickness. However, the heat and pressure during the curing process destroys the chip sometimes. Therefore, COG is the standard for low-res LCDs (monochrome like character ones and color like a feature phone) but high-res panels (TV, PC, smartphones), where a small bezel is needed and/or low yield would lead to too much value lost, use COF (chip on flex), where the LCD driver is soldered to the FPC (flex printed circuit, which is also the flat cable) and then the wide FPC connector (with connections to the thousands of rows and columns, not just the serial interface) is bonded to the glass with ACF.

What is the other COG, anyway? Church of God? Children's Oncology Group?