this post was submitted on 04 Jul 2024
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Samsung

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[–] [email protected] 3 points 4 months ago

TL;DR

  • Samsung is reportedly working on a new cooling solution for future Exynos smartphone processors.
  • This packaging tech is apparently derived from PCs and servers and sees a type of heatsink attached to the top of the processor.
  • Work on the tech could be completed by Q4 2024, suggesting the Exynos 2500 could potentially use it.