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Huawei says its new smartphone chip is entirely free of any US-made components (www.techradar.com)
submitted 14 hours ago* by to c/sino@hexbear.net
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  • Huawei's new Kirin 9050 Pro is being called its "most powerful" all-Chinese chip tech giant has ever made

  • Huawei is claiming a 55% density gain by 'folding' its chip in half and stacking it instead of shrinking the actual die

  • The chip still uses US hardware and foreign technology to manufacture, including ASML scanners and pre-2022 Applied Materials and Lam Research equipment

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[–] 8 points 12 hours ago

I had always assumed the flat approach was done due to heatsink requirements. I expect strong performance from their approach but I'm far more interested to see operating temperature under load since that will impact lifespan of the chip. Reducing power loss (presumably with the lower voltage) may balance that out effectively

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